Display device and method of manufacturing the same

ABSTRACT

Display device and method of manufacturing the display device are provided. According to an exemplary embodiment of the present disclosure, a display device includes a display panel having a display area and a pad area, which is spaced apart from the display area; a protective film disposed on one surface of the display panel; and a middle layer interposed between the protective film and the display panel, wherein the middle layer has a light-blocking area and a light-transmitting area, the light-blocking area overlaps with the display area, and the light-transmitting area overlaps with the pad area.

This application is a divisional application of U.S. patent applicationSer. No. 15/993,009 filed on May 30, 2018, which claims priority under35 USC § 119 to Korean Patent Application No. 10-2017-0140095, filed onOct. 26, 2017, in the Korean Intellectual Property Office, thedisclosures of which are incorporated herein in their entirety byreference.

BACKGROUND 1. Field

The present disclosure relates to a display device and a method ofmanufacturing the same.

2. Description of the Related Art

Display devices have increasingly become important in accordance withdevelopments in multimedia technology. Accordingly, various types ofdisplay devices such as a liquid crystal display (LCD) device, anorganic light-emitting display device, etc. have been used.

The LCD device, which is one of the most widely-used flat paneldisplays, includes two substrates on which field-generating electrodessuch as pixel electrodes and a common electrode are formed and a liquidcrystal layer which is interposed between the two substrates. The LCDdevice forms an electric field in the liquid crystal layer by applyingvoltages to the field-generating electrodes so as to determine theorientation of liquid crystal molecules in the liquid crystal layer, anddisplays an image by controlling the polarization of light incidentthereupon using the electric field.

The organic light-emitting display device displays an image usinglight-emitting diodes (OLEDs), which generate light through therecombination of electrons and holes. The organic light-emitting displaydevice has many advantages such as fast response speed, high luminance,wide viewing angle, and low power consumption.

SUMMARY

Exemplary embodiments of the present disclosure provide a display devicecapable of preventing wiring patterns from becoming visible due to thereflection of external light.

Exemplary embodiments of the present disclosure also provide a method ofmanufacturing a display device capable of preventing wiring patternsfrom becoming visible due to the reflection of external light.

However, exemplary embodiments of the present disclosure are notrestricted to those set forth herein. The above and other exemplaryembodiments of the present disclosure will become more apparent to oneof ordinary skill in the art to which the present disclosure pertains byreferencing the detailed description of the present disclosure givenbelow.

According to an exemplary embodiment of the present disclosure, adisplay device includes: a display panel having a display area and a padarea, the pad area being spaced apart from the display area; aprotective film disposed on one surface of the display panel; and amiddle layer interposed between the protective film and the displaypanel, wherein the middle layer has a light-blocking area and alight-transmitting area, the light-blocking area overlaps with thedisplay area, and the light-transmitting area overlaps with the padarea.

The display panel may further have a non-display area that is disposedoutside the display area, and the light-blocking area may partiallycover the non-display area.

Outer boundaries of the light-blocking area may be disposed inside outerboundaries of the non-display area.

The light-blocking area may only overlap with the display area.

The light-blocking area may include a light-blocking printed layer thatis formed on the protective film.

The light-blocking printed layer may comprise a black pigment.

The display device may further include an adhesive layer covering thelight-blocking printed layer and the protective film, wherein thelight-transmitting area is provided by the adhesive layer.

The middle layer may include a light-blocking adhesive layer, and thelight-blocking adhesive layer may have a light-transmitting areacorresponding to the light-transmitting area of the middle layer and alight-blocking area corresponding to the light-blocking area of themiddle layer.

One surface of the light-blocking adhesive layer may be placed incontact with the protective film, and the other surface of thelight-blocking adhesive layer may be placed in contact with the displaypanel.

The display device may further include an impact absorbing layerdisposed on one surface of the protective film.

The display device may further include an adhesive layer disposedbetween the impact absorbing layer and the protective film, wherein onesurface of the adhesive layer is placed in contact with the impactabsorbing layer and the other surface of the adhesive layer is placed incontact with the protective film.

The light-transmitting area may have a light transmittance of 50% orhigher for light having a wavelength of 550 nm.

The light-blocking area may have a light transmittance of 10% or lowerfor light having a wavelength of 550 nm.

According to another exemplary embodiment of the present disclosure, amethod of manufacturing a display device includes: forming a middlelayer, which has a light-blocking area and a light-transmitting area, ona protective film; and bonding the protective film with the middle layerformed thereon and a display panel, wherein the display panel has adisplay area and a pad area, the pad area being spaced apart from thedisplay area, the light-blocking area overlaps with the display area,and the light-transmitting area overlaps with the pad area.

The forming the middle layer may include forming, on the protectivefilm, a light-blocking printed layer that partially covers theprotective film.

The method may further include forming an adhesive layer on thelight-blocking printed layer and the protective film.

The display panel may further have a non-display area that is disposedoutside the display area, and the light-blocking area may partiallycover the non-display area.

The light-blocking area may only overlap with the display area.

The light-transmitting area may have a light transmittance of 50% orhigher for light having a wavelength of 550 nm.

The light-blocking area may have a light transmittance of 10% or lowerfor light having a wavelength of 550 nm.

According to the aforementioned and other exemplary embodiments of thepresent disclosure, wiring patterns can be prevented from becomingvisible due to external light.

Other features and exemplary embodiments may be apparent from thefollowing detailed description, the drawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other exemplary embodiments and features of the presentdisclosure will become more apparent by describing in detail exemplaryembodiments thereof with reference to the attached drawings, in which:

FIG. 1 is a cross-sectional view of a display device according to anexemplary embodiment of the present disclosure;

FIG. 2 is a layout view of the display device according to the exemplaryembodiment of FIG. 1 ;

FIG. 3 is a layout view of a display device according to anotherexemplary embodiment of the present disclosure;

FIG. 4 is a layout view of a display device according to anotherexemplary embodiment of the present disclosure;

FIG. 5 is a cross-sectional view of a display device according toanother exemplary embodiment of the present disclosure;

FIG. 6 is a cross-sectional view of a display device according toanother exemplary embodiment of the present disclosure;

FIG. 7 is a cross-sectional view of a display device according toanother exemplary embodiment of the present disclosure;

FIG. 8 is a cross-sectional view of a display device according toanother exemplary embodiment of the present disclosure;

FIG. 9 is a cross-sectional view illustrating a method of manufacturinga display device according to an exemplary embodiment of the presentdisclosure;

FIG. 10 is a cross-sectional view illustrating the method ofmanufacturing a display device according to an exemplary embodiment ofthe present disclosure;

FIG. 11 is a cross-sectional view illustrating a method of manufacturinga display device according to another exemplary embodiment of thepresent disclosure; and

FIG. 12 is a cross-sectional view illustrating the method ofmanufacturing a display device according to another exemplary embodimentof the present disclosure.

DETAILED DESCRIPTION

The advantages and features of the present inventive concept and methodsfor achieving the advantages and features will be apparent by referringto the embodiments to be described in detail with reference to theaccompanying drawings. However, the present inventive concept is notlimited to the embodiments disclosed hereinafter, but can be implementedin diverse forms. The matters defined in the description, such as thedetailed construction and elements, are nothing but specific detailsprovided to assist those of ordinary skill in the art in a comprehensiveunderstanding of the present inventive concept, and the presentinventive concept is only defined within the scope of the appendedclaims.

Where an element is described as being related to another element suchas being “on” another element or “located on” a different layer or alayer, includes both a case where an element is located directly onanother element or a layer and a case where an element is located onanother element via another layer or still another element. In contrast,where an element is described as being is related to another elementsuch as being “directly on” another element or “located directly on” adifferent layer or a layer, indicates a case where an element is locatedon another element or a layer with no intervening element or layertherebetween. In the entire description of the present inventiveconcept, the same drawing reference numerals are used for the sameelements across various figures.

Although the terms “first, second, and so forth” are used to describediverse constituent elements, such constituent elements are not limitedby the terms. The terms are used only to discriminate a constituentelement from other constituent elements. Accordingly, in the followingdescription, a first constituent element may be a second constituentelement.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “At least one” is not to be construed as limiting “a” or“an.” “Or” means “and/or.” As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed items.It will be further understood that the terms “comprises” and/or“comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10% or 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, embodiments of the present inventive concept will bedescribed with reference to the attached drawings.

FIG. 1 is a cross-sectional view of a display device according to anexemplary embodiment of the present disclosure. FIG. 2 is a layout viewof the display device according to the exemplary embodiment of FIG. 1 .

Referring to FIGS. 1 and 2 , the display device according to anexemplary embodiment of the present disclosure includes a display panelP, a protective film PF, and a middle layer ML. The display deviceaccording to an exemplary embodiment of the present disclosure mayfurther include a heat dissipation layer 100, a wiring pattern layer200, an impact absorbing layer BL, first, second, third, and fourthadhesive layers AD1, AD2, AD3 and AD4, a polarizing layer POL, and awindow W.

The heat dissipation layer 100 may dissipate heat generated in thedisplay panel P that will be described later. The heat dissipation layer100 may be in the shape of a thin plate.

FIG. 1 illustrates an example in which the heat dissipation layer 100 isa single layer, but the present disclosure is not limited thereto. Inanother example, the heat dissipation layer 100 may be a stack of two ormore layers.

In one exemplary embodiment, the heat dissipation layer 100 may includea thin film of a metal such as gold (Au), silver (Ag), or copper (Cu),or may comprise graphite and carbon nanotubes.

The wiring pattern layer 200 may be disposed on the heat dissipationlayer 100. The wiring pattern layer 200 may include wiring patterns 200a and insulating layers (200 b and 200 c), which surround the wiringpatterns 200 a from above and below the wiring patterns 200 a.Specifically, the wiring pattern layer 200 may include a firstinsulating layer 200 b, the wiring patterns 200 a, which are disposed onthe top surface of the first insulating layer 200 b, and a secondinsulating layer 200 c, which covers the top surfaces of the wiringpatterns 200 a. The wiring patterns 200 a may cover parts of the topsurface of the first insulating layer 200 b and may expose other partsof the top surface of the first insulating layer 200 b. The secondinsulating to layer 200 c may be disposed not only on the top surfaceand the sides of each of the wiring patterns 200 a, but also on theexposed parts of the top surface of the first insulating layer 200 b.

The wiring patterns 200 a may comprise a metal material such as Cu, Ag,nickel (Ni), or tungsten (W). Each of the wiring patterns 200 a may be asingle film or a stack of a plurality of films. In one exemplaryembodiment, each of the wiring patterns 200 a may be a double filmconsisting of a lower Cu film and an upper Cu film. The wiring patterns200 a may be wires or electrodes transmitting signals or may be floatingwires or electrodes.

The first and second insulating layers 200 b and 200 c may be formed ofan organic insulating material, an inorganic insulating material, or thecombination thereof or may be formed of a bonding material such as anadhesive material.

In one exemplary embodiment, the wiring pattern layer 200 may be adigitizer. The digitizer, unlike an input device such as a keyboard or amouse, receives information regarding a position on a screen, designatedby a user. The digitizer recognizes the movement of, for example, astylus pen, and converts the recognized movement into a digital signal.The digitizer may be provided in the form of a thin film or a panel.

The impact absorbing layer BL may be disposed on the wiring patternlayer 200. The impact absorbing layer BL may absorb an external impactand may thus prevent the display device according to an exemplaryembodiment of the present disclosure from being damaged. The impactabsorbing layer BL may comprise an elastic material such as apolyurethane (PU) or polyethylene (PE) resin. In one exemplaryembodiment, the impact absorbing layer BL may be a cushion layer.

A first adhesive layer AD1 may be disposed on the wiring pattern layer200.

The first adhesive layer AD1 may be disposed between the impactabsorbing layer BL and the protective film PF and may bond the impactabsorbing layer BL and the protective film PF together. That is, onesurface of the first adhesive layer AD1 may be placed in contact withthe impact absorbing layer BL, and the other surface of the firstadhesive layer AD1 may be placed in contact with the protective film PF.

In one exemplary embodiment, the first adhesive layer AD1 may comprise aphotocurable resin or a thermosetting resin having a high transmittanceand an adhesive performance. For example, the first adhesive layer AD1may be obtained by applying a resin such as an acrylic resin andirradiating the resin with ultraviolet (UV) light so as to cure theresin.

In one exemplary embodiment, the first adhesive layer AD1 may include apressure sensitive adhesive (PSA).

In one exemplary embodiment, the first adhesive layer AD1 may include anoptically clear adhesive (OCA).

In one exemplary embodiment, the first adhesive layer AD1 may have athickness of 10 μm to 200 μm.

The protective film PF may be disposed on the first adhesive layer AD1.The protective film PF may be attached to the bottom of the displaypanel P and may thus protect the display panel P. In one exemplaryembodiment, the protective film PF may be formed of at least onematerial selected from among polyethylene terephthalate (PET),polyethylene naphthalate (PEN), polyethylene sulfide (PES), and PE.

The middle layer ML may be disposed on the protective film PF. Themiddle layer ML may be disposed between the protective film PF and thedisplay panel P.

The middle layer ML may have a light-blocking area LB and alight-transmitting area LT.

The light-blocking area LB may absorb or reflect light provided from theoutside. The light-transmitting area LT may transmit light provided fromthe outside therethrough.

In one exemplary embodiment, the light-blocking area LB may have a lighttransmittance of 10% or lower for light having a wavelength of 550 nm,but the present disclosure is not limited thereto. That is, in anotherexemplary embodiment, the light-blocking area LB may have a lighttransmittance of 1% or lower for light having a wavelength of 550 nmbecause the lower the transmittance of the light-blocking area LB, thebetter in terms of the advantageous effects of the inventive concept ofthe present disclosure.

In one exemplary embodiment, the light-transmitting area LT may have alight transmittance of 50% or higher for light having a wavelength of550 nm In a case where the light-transmitting area LT has a lighttransmittance of 50% or higher, the display panel P can become visiblefrom below the protective film PF, and as a result, the alignment of theprotective film PF and the display panel P can be facilitated.

A second adhesive layer AD2 may be disposed on the middle layer ML. Thesecond adhesive layer AD2 may bond the middle layer ML and the displaypanel P together.

In one exemplary embodiment, the second adhesive layer AD2 may comprisea photocurable resin or a thermosetting resin having a hightransmittance and an adhesive performance. For example, the secondadhesive layer AD2 may be obtained by applying a resin such as anacrylic resin and irradiating the resin with UV light so as to cure theresin.

In one exemplary embodiment, the second adhesive layer AD2 may include aPSA.

In one exemplary embodiment, the second adhesive layer AD2 may includean OCA.

In one exemplary embodiment, the second adhesive layer AD2 may have athickness of 10 μm to 200 μm.

The display panel P may be disposed on the second adhesive layer AD2. Inone exemplary embodiment, the display panel P may be a display panel foruse in an organic light-emitting display device, but the presentdisclosure is not limited thereto. In another exemplary embodiment, thedisplay panel P may be a display panel for use in a liquid crystaldisplay (LCD) device or another type of display device.

Examples of the display panel P will be described later with referenceto FIGS. 7 and 8 .

Referring again to FIG. 2 , the display panel P may have a display areaDA, a non-display area NDA, and a pad area PA.

The display area DA is defined as an area in which to display an image.In the display area DA, a plurality of pixel units PX for realizing animage may be disposed.

The non-display area NDA is disposed on the outside of the display areaDA and is defined as an area in which no image is displayed. In oneexemplary embodiment, the non-display area NDA may be disposed tosurround the display area DA. FIG. 2 illustrates an example in which thenon-display area NDA surrounds the display area DA, but the presentdisclosure is not limited thereto. In another exemplary embodiment, thenon-display area NDA may be disposed adjacent only to one side or theother side of the display area DA or may be disposed to one or bothsides of the display area DA.

The pad area PA may be defined in the non-display area NDA. In oneexemplary embodiment, the pad area PA may be disposed to be spaced apartfrom the display area DA over the non-display area NDA.

Although not specifically illustrated, a plurality of pads may bedisposed in the pad area PA. The plurality of pads may be electricallyconnected to a flexible printed circuit board FPC that will be describedlater.

In one exemplary embodiment, the light-blocking area LB of the middlelayer ML may overlap with the display area DA and may partially overlapwith the entire non-display area NDA except for the pad area PA.

In one exemplary embodiment, the light-blocking area LB may completelycover the display area DA. Also, the light-blocking area LB maypartially cover the non-display area NDA. Specifically, thelight-blocking area LB may partially cover the entire non-display areaNDA except for the pad area PA.

Most of external light provided to the display device according to anexemplary embodiment of the present disclosure is reflected even beforearriving at the protective film PF, but some of the external light maycause the wiring patterns of the digitizer, disposed below theprotective film PF, to become visible from the outside. On the otherhand, in a case where the light-blocking area LB overlaps with thedisplay area DA, external light can be prevented from passing throughthe protective film PF, and as a result, the wiring patterns of thedigitizer can be prevented from becoming visible from the outside.

The light-blocking area LB may not overlap with the pad area PA. Inother words, the pad area PA may overlap with the light-transmittingarea LT.

If the pad area PA overlaps with the light-blocking area LB, theprotective film PF and the display panel P may not be able to beproperly aligned in the process of bonding them together. On the otherhand, in a case where the pad area PA overlaps with thelight-transmitting area LT, as described above, the display panel P canbecome visible from below the protective film PF, and thus, theprotective film PF and the display panel P can be precisely aligned andproperly bonded.

The display device according to an exemplary embodiment of the presentdisclosure may further include the flexible printed circuit board FPC.The flexible printed circuit board FPC may overlap with the pad area PAand may be electrically connected to the pad area PA.

In one exemplary embodiment, as illustrated in FIG. 1 , an anisotropicconductive film ACF may be interposed between the flexible printedcircuit board FPC and the pad area PA. In other words, the flexibleprinted circuit board FPC and the pad area PA may be electricallyconnected by the anisotropic conductive film ACF.

Referring again to FIG. 2 , a driving integrated circuit (IC) 350 may bedisposed on the flexible printed circuit board FPC. The driving IC 350may generate signals necessary for driving the display device accordingto an exemplary embodiment of the present disclosure and may transmitthe generated signals to the display area DA. That is, the displaydevice according to an exemplary embodiment of the present disclosuremay be a chip-on-film (COF)-type display device.

Referring again to FIG. 1 , a third adhesive layer AD3 may be disposedon the display panel P.

The third adhesive layer AD3 may bond the polarizing layer POL and thedisplay panel P together.

In one exemplary embodiment, the third adhesive layer AD3 may comprise aphotocurable resin or a thermosetting resin having a high transmittanceand an adhesive performance. For example, the third adhesive layer AD3may be obtained by applying a resin such as an acrylic resin andirradiating the resin with UV light so as to cure the resin.

In one exemplary embodiment, the third adhesive layer AD3 may include aPSA.

In one exemplary embodiment, the third adhesive layer AD3 may include anOCA.

In one exemplary embodiment, the third adhesive layer AD3 may have athickness of 10 μm to 200 μm.

The polarizing layer POL may be disposed on the third adhesive layerAD3.

The polarizing layer POL may reduce the reflectance of external lightincident thereupon from the outside. In one exemplary embodiment, thepolarizing layer POL may include a retarder and a polarizer.

In another exemplary embodiment, the polarizing layer POL may not beprovided. In this exemplary embodiment, a black matrix (not illustrated)and/or color filters (not illustrated) may be provided to prevent colorseparation that may be caused by the reflection of external light.

A fourth adhesive layer AD4 may be disposed on the polarizing layer POL.The fourth adhesive layer AD4 may bond the polarizing layer POL and thewindow W together. In one exemplary embodiment, the fourth adhesivelayer AD4 may comprise a photocurable resin or a thermosetting resinhaving a high transmittance and an adhesive performance. For example,the fourth adhesive layer AD4 may be obtained by applying a resin suchas an acrylic resin and irradiating the resin with UV light so as tocure the resin.

In one exemplary embodiment, the fourth adhesive layer AD4 may include aPSA.

In one exemplary embodiment, the fourth adhesive layer AD4 may includean OCA.

In one exemplary embodiment, the fourth adhesive layer AD4 may have athickness of 10 μm to 200 μm.

The window W may be disposed on the fourth adhesive layer AD4.

In one exemplary embodiment, the window W may be formed of a transparentglass or plastic material. That is, the window W may be formed of alight-transmitting material.

In one exemplary embodiment, the window W may be flexible. In otherwords, the window W may be formed of a bendable, foldable, or rollablematerial or have a bendable, foldable, or rollable structure and maythus be bendable, foldable, or rollable.

Display devices according to other exemplary embodiments of the presentdisclosure will hereinafter be described. Some elements that willhereinafter be described may be substantially the same as theirrespective counterparts of the display device according to an exemplaryembodiment of the present disclosure, and thus, detailed descriptionsthereof may be omitted for clarity.

FIG. 3 is a layout view of a display device according to anotherexemplary embodiment of the present disclosure.

Referring to FIG. 3 , a light-blocking area LB1 of a middle layer ML1may only overlap with a display area DA.

A non-display area NDA may overlap with a light-transmitting area LT1 ofthe middle layer ML1. Also, a pad area PA may overlap with thelight-transmitting area LT1.

As already mentioned above, since the light-blocking area LB1 overlapswith the display area DA, the wiring of a digitizer can be preventedfrom becoming visible from the outside, and since the light-transmittingarea LT1 overlaps with the non-display area NDA, a display panel P canbecome visible from below a protective film PF during the bonding of theprotective film PF and the display panel P, and as a result, thealignment of the protective film PF and the display panel P can befacilitated.

FIG. 4 is a layout view of a display device according to anotherexemplary embodiment of the present disclosure.

Referring to FIG. 4 , a light-blocking area LB2 of a middle layer ML2may cover a display area DA and part of a non-display area NDA. In theexemplary embodiment of FIG. 4 , unlike in the exemplary embodiment ofFIG. 2 where the width of the light-blocking area LB is the same as thewidth of the display panel P, the width of the light-blocking area LB2is smaller than the width of a display panel P.

That is, in one exemplary embodiment, the outer boundaries of thelight-blocking area LB2 may be disposed inside the outer boundaries ofthe non-display area NDA.

Even in this exemplary embodiment, a pad area PA may overlap with alight-transmitting area LT2 of the middle layer ML2.

FIG. 5 is a cross-sectional view of a display device according toanother exemplary embodiment of the present disclosure.

Referring to FIG. 5 , a light-blocking area of a middle layer may beprovided by a light-blocking printed layer BP, and a light-transmittingarea of the middle layer may be provided by a second adhesive layer AD2.

In one exemplary embodiment, the light-blocking area may be obtained bydisposing the light-blocking printed layer BP on a protective film PF.The light-blocking printed layer BP may be formed on part of theprotective film PF. That is, part of the protective film PF where thelight-blocking printed layer BP is formed may become the light-blockingarea, and part of the protective film PF where the light-blockingprinted layer BP is not formed may become the light-transmitting area.

In one exemplary embodiment, the light-blocking printed layer BP maycomprise a colored pigment, particularly, a black pigment.

The planar shape of the light-blocking printed layer BP may besubstantially the same as the planar shape of the light-blocking areaLB, LB1, or LB2 of FIG. 2, 3 , or 4.

In one exemplary embodiment, the light-transmitting area may be an areain which the light-blocking printed layer BP is not formed. The area inwhich the light-blocking printed layer BP is not formed may be filledwith the second adhesive layer AD2. As already mentioned above, thesecond adhesive layer AD2 may be formed of a transparent material.Accordingly, the second adhesive layer AD2 may be able to transmit lighttherethrough.

The second adhesive layer AD2 may be formed on the light-blockingprinted layer BP. The second adhesive layer AD2 may cover thelight-blocking printed layer BP and the protective film PF.

The material of the second adhesive layer AD2 may be substantially thesame as the material of the second adhesive layer AD2 of any one of thedisplay devices according to the previous exemplary embodiments.

FIG. 6 is a cross-sectional view of a display device according toanother exemplary embodiment of the present disclosure. Referring toFIG. 6 , in one exemplary embodiment, a middle layer may be replacedwith a light-blocking adhesive layer BA.

In one exemplary embodiment, the light-blocking adhesive layer BA mayhave a light-blocking area 510 and a light-transmitting area 520.

The light-blocking adhesive layer BA may have an adhesive performanceand may be interposed between a display panel P and a protective filmPF. That is, the light-blocking adhesive layer BA may bond the displaypanel P and the protective film PF together, and as a result, no secondadhesive layer AD2 may be needed.

That is, one surface of the light-blocking adhesive layer BA may beplaced in contact with the protective film PF, and the other surface ofthe light-blocking adhesive layer BA may be placed in contact with thedisplay panel P.

The light-blocking area 410 of the light-blocking adhesive layer BA maycomprise a colored pigment, particularly, a black pigment. Accordingly,the light-blocking area 510 may be able to absorb external light.

The light-transmitting area 520 may be transparent or translucent. Thatis, the light-transmitting area 520 may be able to transmit externallight therethrough.

That is, the light-blocking area LB, LB1, or LB2 of FIG. 2, 3 , or 4 maybe replaced with the light-blocking area 510, and the light-transmittingarea LT, LT1, or LT2 of FIG. 2, 3 , or 4 may be replaced with thelight-transmitting area 520.

The planar shape of the light-blocking area 510 may be substantially thesame as the planar shape of the light-blocking area LB, LB1, or LB2 ofFIG. 2, 3 , or 4.

FIG. 7 is a cross-sectional view of a display device according toanother exemplary embodiment of the present disclosure. Specifically,FIG. 7 is a cross-sectional view taken along line I-I′ of FIG. 2 .

Referring to FIG. 7 , a pixel unit PX may include a buffer layer 210.The buffer layer 210 may be disposed on a first substrate 110. Thebuffer layer 210 may prevent the infiltration of moisture and oxygenfrom the outside through the first substrate 110. Also, the buffer layer210 may planarize the surface of the first substrate 110. In oneexemplary embodiment, the buffer layer 210 may include one of a siliconnitride (SiNx) film, a silicon oxide (SiO₂) film, and a siliconoxynitride (SiOxNy) film. The buffer layer 210 may not be provideddepending on the type of, and the processing conditions for, the firstsubstrate 110.

A semiconductor layer including a semiconductor pattern ACT may bedisposed on the buffer layer 210. The semiconductor layer, particularly,the semiconductor pattern ACT, will hereinafter be described. In oneexemplary embodiment, the semiconductor pattern ACT may be formed bymixing one or two selected from among polycrystalline silicon,monocrystalline silicon, low-temperature polycrystalline silicon,amorphous silicon, and an oxide semiconductor.

In one exemplary embodiment, the semiconductor pattern ACT may include achannel area ACTa, which is not doped with impurities, and source anddrain areas ACTb and ACTc, which are doped with impurities. The sourcearea ACTb is disposed on one side of the channel area ACTa and iselectrically connected to a source electrode SE, which will be describedlater. The drain area ACTc is disposed on the other side of the channelarea ACTa and is electrically connected to a drain electrode DE, whichwill be described later.

A first insulating layer 220 may be disposed on the semiconductor layerincluding the semiconductor pattern ACT. In one exemplary embodiment,the first insulating layer 220 may be a gate insulating layer. In oneexemplary embodiment, the first insulating layer 220 may be formed bymixing at least one selected from the group consisting of an inorganicinsulating material such as SiOx or SiNx and an organic insulatingmaterial such as benzocyclobutene (BCB), an acrylic material, orpolyimide (PI).

A gate conductor including a gate electrode GE may be disposed on thefirst insulating layer 220. The gate electrode GE may overlap with thesemiconductor pattern ACT. The gate conductor may comprise at least oneof an aluminum (Al)-based metal including an Al alloy, an Ag-based metalincluding an Ag alloy, a Cu-based metal including a Cu alloy, amolybdenum (Mo)-based metal including a Mo alloy, chromium (Cr),titanium (Ti), and tantalum (Ta).

A second insulating layer 230 may be disposed on the gate conductorincluding the gate electrode GE. The second insulating layer 230 may beformed by mixing at least one selected from the group consisting of aninorganic insulating material such as silicon oxide (SiOx) or SiNx andan organic insulating material such as BCB, an acrylic material, or PI.

A data conductor including the source electrode SE and the drainelectrode DE may be disposed on the second insulating layer 230. Thesource electrode SE and the drain electrode DE may be disposed on thesecond insulating layer 230 to be spaced apart from each other. The dataconductor may comprise at least one selected from the group consistingof a metal, an alloy, a metal nitride, a conductive metal oxide, and atransparent conductive material. In one exemplary embodiment, the dataconductor may comprise Ni, cobalt (Co), Ti, Ag, Cu, Mo, Al, beryllium(Be), niobium (Nb), Au, iron (Fe), selenium (Se), or Ta and may have asingle- or multilayer structure. Alternatively, an alloy of at least oneselected from the group consisting of Ti, zirconium (Zr), W, Ta, Nb,platinum (Pt), hafnium (Hf), oxygen (O), and nitrogen (N) may be used asthe material of the source electrode SE and the drain electrode DE.

The semiconductor pattern ACT, the gate electrode GE, the sourceelectrode SE, and the drain electrode DE may form a switching elementTR2. FIG. 3 illustrates an example in which the switching element TR2 isof a top-gate-type, but the present disclosure is not limited thereto.That is, alternatively, the switching element TR2 may be of abottom-gate-type.

A planarization layer 240 may be disposed on the data conductor. Theplanarization layer 240 eliminates any height difference therebelow andcan thus improve the emission efficiency of a pixel electrode 250 and anorganic light-emitting layer 270, which will be described later. In oneexemplary embodiment, the planarization layer 240 may comprise anorganic material. In one example, the planarization layer 240 maycomprise at least one selected from among PI, polyacryl, andpolysiloxane. In another example, the planarization layer 240 maycomprise an inorganic material or the combination of an inorganicmaterial and an organic material. A first contact hole CNT1 may beformed in the planarization layer 240 to at least partially expose thedrain electrode DE.

The pixel electrode 250 may be disposed on the planarization layer 240.The pixel electrode 250 may be electrically connected to part of thedrain electrode DE exposed by the first contact hole CNT1. That is, thepixel electrode 250 may be an anode, which is a hole injectionelectrode. In a case where the pixel electrode 250 is an anodeelectrode, the pixel electrode 250 may comprise a material having a highwork function so as to facilitate the injection of holes. Also, thepixel electrode 250 may be a reflective electrode, a transflectiveelectrode, or a transmissive electrode. In one exemplary embodiment, thepixel electrode 250 may comprise a reflective material. In one exemplaryembodiment, the reflective material may include at least one selectedfrom the group consisting of Ag, magnesium (Mg), Cr, Au, Pt, Ni, Cu, W,Al, Al-lithium (Al—Li), Mg-indium (Mg—In), and Mg—Ag.

In one exemplary embodiment, the pixel electrode 250 may be formed as asingle layer, but the present disclosure is not limited thereto. Thatis, alternatively, the pixel electrode 250 may be formed as a multilayerhaving a stack of two different materials.

In one exemplary embodiment, in a case where the pixel electrode 250 isformed as a multilayer, the pixel electrode 250 may include a reflectivefilm and a transparent or transflective electrode disposed on thereflective film. In another exemplary embodiment, the pixel electrode250 may include a reflective film and a transparent or transflectiveelectrode disposed below the reflective film. For example, the pixelelectrode 250 may have a triple-layer structure of indium tin oxide(ITO)/Ag/ITO, but the present disclosure is not limited thereto.

Here, the transparent or transflective electrode may comprise at leastone selected from the group consisting of ITO, indium zinc oxide (IZO),zinc oxide (ZnO), indium oxide (In₂O₃), indium gallium oxide (IGO), andaluminum zinc oxide (AZO).

A pixel defining film 260 may be disposed on the pixel electrode 250.The pixel defining film 260 may include an opening, which at leastpartially exposes the pixel electrode 250. The pixel defining film 260may comprise an organic material or an inorganic material. In oneexemplary embodiment, the pixel defining film 260 may comprisephotoresist, a PI-based resin, an acrylic resin, a silicon compound, ora polyacrylic resin.

The organic light-emitting layer 270 may be disposed on the pixelelectrode 250 and the pixel defining film 260. Specifically, the organiclight-emitting layer 270 may be disposed on part of the pixel electrode250 exposed by the opening of the pixel defining film 260. In oneexemplary embodiment, the organic light-emitting layer 270 may at leastpartially cover the sidewalls of the pixel defining film 260.

In one exemplary embodiment, the organic light-emitting layer 270 mayemit one of red, blue, and green colors. In another exemplaryembodiment, the organic light-emitting layer 270 may emit a white coloror one of cyan, magenta, and yellow colors. In a case where the organiclight-emitting layer 270 emits a white color, the organic light-emittinglayer 270 may comprise a white light-emitting material or may have astack of red, green, and blue light-emitting layers.

A common electrode 280 may be disposed on the organic light-emittinglayer 270 and the pixel defining film 260. In one exemplary embodiment,the common electrode 280 may be formed on the entire surfaces of theorganic light-emitting layer 270 and the pixel defining film 260. In oneexemplary embodiment, the common electrode 280 may be a cathode. In oneexemplary embodiment, the common electrode 280 may comprise at least oneselected from the group consisting of Li, calcium (Ca), lithium fluoride(LiF)/Ca, LiF/Al, Al, Ag, and Mg. The common electrode 280 may be formedof a material with a low work function. In one exemplary embodiment, thecommon electrode 280 may be a transparent or transflective electrodeformed of at least one selected from the group consisting of ITO, IZO,ZnO, In₂O₃, IGO, and AZO.

The pixel electrode 250, the organic light-emitting layer 270, and thecommon electrode 280 may form an organic light-emitting diode (OLED)“OLED”, but the present disclosure is not limited thereto. That is, theOLED “OLED” may have a multilayer structure including a hole injectionlayer (HIL), a hole transport layer (HTL), an electron transport layer(ETL), and an electron injection layer (EIL).

A second substrate 290 may be disposed to face the first substrate 110.The second substrate 290 may be coupled to the first substrate 110 viaan additional sealing member. In one exemplary embodiment, the secondsubstrate 290 may be a transparent insulating substrate. In a case wherethe second substrate 290 is a transparent insulating substrate, thetransparent insulating substrate may be a glass substrate, a quartzsubstrate, or a transparent resin substrate.

FIG. 8 is a cross-sectional view of a display device according toanother exemplary embodiment of the present disclosure. Specifically,FIG. 8 illustrates a modified example of the display device of FIG. 8 .

Referring to FIG. 8 , in one exemplary embodiment, an encapsulationlayer 300 may be disposed on a first substrate 110_2.

The encapsulation layer 300 may prevent the infiltration of moisture andair from the outside into an OLED “OLED”. In one exemplary embodiment,the encapsulation layer 300 may include a first inorganic layer 301, anorganic layer 302, and a second inorganic layer 303.

The first inorganic layer 301 may be disposed on a common electrode 280.The first inorganic layer 301 may comprise at least one selected fromthe group consisting of SiOx, SiNx, and SiONx.

The organic layer 302 may be disposed on the first inorganic layer 301.The organic layer 302 may comprise one selected from the groupconsisting of epoxy, acrylate, and urethane acrylate. The organic layer302 may planarize a height difference formed by a pixel defining film260.

The second inorganic layer 303 may be disposed on the organic layer 302.The second inorganic layer 303 may comprise at least one selected fromthe group consisting of SiOx, SiNx, and SiONx.

FIG. 8 illustrates an example in which the first inorganic layer 301,the organic layer 302, and the second inorganic layer 303 are all singlelayers, but the present disclosure is not limited thereto. That is,alternatively, at least one of the first inorganic layer 301, theorganic layer 302, and the second inorganic layer 303 may have amultilayer structure.

In another exemplary embodiment, the encapsulation layer 300 may includea hexamethyldisiloxane (HMDSO) layer. Specifically, the encapsulationlayer 300 may include a first inorganic layer 301, a second inorganiclayer 303, and the HMDSO layer, which is disposed between the first andsecond inorganic layers 301 and 303. That is, the organic layer 302 maybe replaced with the HMDSO layer.

In one exemplary embodiment, the HMDSO layer may be formed in the samechamber as the first inorganic layer 301 after the formation of thefirst inorganic layer 301. In this manner, the formation of theencapsulation layer 300 can be simplified. Also, since the HMDSO layer,which is capable of absorbing stress, is included in the encapsulationlayer 300, the encapsulation layer 300 may become sufficiently flexible.

Methods of manufacturing a display device according to exemplaryembodiments of the present disclosure will hereinafter be described.Some elements that will hereinafter be described may be substantiallythe same as their respective counterparts of any one of the displaydevices according to the above-described exemplary embodiments, andthus, detailed descriptions thereof may be omitted for clarity.

FIG. 9 is a cross-sectional view illustrating a method of manufacturinga display device according to an exemplary embodiment of the presentdisclosure. FIG. 10 is a cross-sectional view illustrating the method ofmanufacturing a display device according to an exemplary embodiment ofthe present disclosure.

Referring to FIGS. 9 and 10 , the method of manufacturing a displaydevice according to an exemplary embodiment of the present disclosuremay include forming a middle layer, which has a light-blocking area anda light-transmitting area, on a protective film PF and bonding theprotective film PF and a display panel P together.

The forming of the middle layer may include forming a light-blockingprinted layer BP on the protective film PF. The light-blocking printedlayer BP may comprise a colored pigment, particularly, a black pigment.In one exemplary embodiment, the light-blocking printed layer BP may beformed by printing or spraying.

FIG. 9 illustrates how to form the light-blocking printed layer BPthrough printing using a nozzle 800.

As already mentioned above with reference to FIG. 5 , the light-blockingprinted layer BP may be formed on part of the protective film PF.

That is, part of the protective film PF where the light-blocking printedlayer BP is formed may form a light-blocking area, and part of theprotective film PF where the light-blocking printed layer BP is notformed may form a light-transmitting area.

Thereafter, referring to FIG. 10 , the bonding of the protective film PFand the display panel P may be performed. The bonding of the protectivefilm PF and the display panel P may include interposing a secondadhesive layer AD2 between the protective film PF and the display panelP. The second adhesive layer AD2 may be formed on the display panel Pand/or on the protective film PF.

Thereafter, the protective film PF and the display panel P may bebrought close to each other and may then be bonded together. As alreadymentioned above, the display panel P can be viewed through thelight-transmitting area (i.e., the part of the protective film PF wherethe light-blocking printed layer BP is not formed), even from below theprotective film PF, and as a result, the display panel P and theprotective film PF can be properly bonded together while being preciselyaligned with each other.

A display device obtained by the method of manufacturing a displaydevice according to an exemplary embodiment of the present disclosuremay be substantially the same as any one of the display devicesaccording to the above-mentioned exemplary embodiments. Steps of themethod of manufacturing a display device according to an exemplaryembodiment of the present disclosure that have not been described may beperformed in well-known manners.

FIG. 11 is a cross-sectional view illustrating a method of manufacturinga display device according to another exemplary embodiment of thepresent disclosure. FIG. 12 is a cross-sectional view illustrating themethod of manufacturing a display device according to another exemplaryembodiment of the present disclosure.

The exemplary embodiment of FIGS. 11 and 12 differs from the exemplaryembodiment of FIGS. 9 and 10 in that a light-blocking adhesive layer BAis formed as a middle layer.

Referring to FIG. 11 , the light-blocking adhesive layer BA may beformed on a protective film PF. The light-blocking adhesive layer BA mayhave a light-blocking area 510 and a light-transmitting area 520. Thelight-blocking area 510 and the light-transmitting area 520 may besubstantially the same as their respective counterparts of FIG. 6 .

Thereafter, referring to FIG. 12 , the bonding of the protective film PFand a display panel P may be performed. The light-blocking adhesivelayer BA may have an adhesive performance and may thus be able to bondthe protective film PF and the display panel P together. That is, in theexemplary embodiment of FIGS. 11 and 12 , unlike in the exemplaryembodiment of FIGS. 9 and 10 , a second adhesive layer AD2 may not beprovided.

However, the effects of the present inventive concept are not restrictedto the one set forth herein. The above and other effects of the presentinventive concept will become more apparent to one of daily skill in theart to which the present inventive concept pertains by referencing theclaims.

While the present inventive concept has been particularly illustratedand described with reference to exemplary embodiments thereof, it willbe understood by those of ordinary skill in the art that various changesin form and detail may be made therein without departing from the spiritand scope of the present inventive concept as defined by the followingclaims. The exemplary embodiments should be considered in a descriptivesense only and not for purposes of limitation.

What is claimed is:
 1. A method of manufacturing a display device,comprising: providing a protective film; forming a middle layer, whichhas a light-blocking area and a light-transmitting area, on theprotective film; and bonding the protective film with the middle layerformed thereon and a display panel, wherein the display panel has adisplay area and a pad area, the pad area being spaced apart from thedisplay area, the light-blocking area overlaps the display area, thelight-transmitting area overlaps the pad area, and the display panelincludes a first surface which faces the middle layer and a secondsurface which faces a window.
 2. The method of claim 1, wherein formingthe middle layer is accomplished by forming, on the protective film, alight-blocking printed layer that partially covers the protective film.3. The method of claim 2, further comprising: forming an adhesive layerdisposed on the light-blocking printed layer and the protective film. 4.The method of claim 1, wherein the display panel further has anon-display area that is disposed outside the display area, and thelight-blocking area partially covers the non-display area.
 5. The methodof claim 1, wherein the light-blocking area only overlaps the displayarea.
 6. The method of claim 1, wherein the light-transmitting area hasa light transmittance of 50% or higher for light having a wavelength of550 nm.
 7. The method of claim 1, wherein the light-blocking area has alight transmittance of 10% or lower for light having a wavelength of 550nm.
 8. The method of claim 1, wherein the middle layer bonds the displaypanel and the protective film together.
 9. A method of manufacturing adisplay device, comprising: providing a protective film; forming amiddle layer, which has a light-blocking area and a light-transmittingarea, on the protective film; and bonding the protective film with themiddle layer formed thereon and a display panel, wherein the displaypanel has a display area and a pad area, the pad area being spaced apartfrom the display area, the light-blocking area overlaps the displayarea, the light-transmitting area overlaps the pad area, a circuit boardis electrically connected to a plurality of pads through a conductivefilm, the conductive film overlaps the light-transmitting area, and theconductive film does not overlap the light-blocking area.